In the pursuit of efficient and cost-effective power conversion, the industry is witnessing a paradigm shift towards the adoption of new technologies and innovative topologies. The increasing pressure to reduce system costs has led to the emergence of game-changing solutions, such as Gallium Nitride (GaN) and Silicon Carbide (SiC) power devices. These wide-bandgap semiconductors offer superior performance, enabling higher power density, faster switching speeds, and reduced losses.
When combined with novel topologies and advanced packaging techniques, these new technologies are unlocking unprecedented opportunities for system cost savings.
Join this webinar at our March Virtual Conference on EV Engineering, presented by Infineon, to learn how designers can leverage the unique characteristics of GaN and SiC to create more compact, efficient, and reliable power conversion systems that minimize component count, reduce thermal management requirements, and optimize overall system performance.
Other sessions at our next Virtual Conference include:
Mitigating Stress In PCB Assemblies: Understanding Thermal Gap Filler Compression And PCB Deflection
Thermal gap fillers are essential for managing heat in today’s compact electronics, but they can also introduce unwanted stress and deflection in your PCB assemblies.
Join us for this insightful webinar, presented by Fujipoly, where we’ll unravel the complexities of thermal gap filler implementation and PCB mechanics. We’ll explore:
- Types of Gap Fillers – Discover the differences of dispensable, putty, and viscoelastic gap fillers, and learn which is best suited for your application.
- Compression Characteristics – Understand how factors like gap filler type, thickness, and compression rate impact the stress exerted on your PCB
- PCB Deflection – Learn how a PCB reacts under load and how the addition of a gap filler and support structure location influences deflection
- Stress Management Techniques – Gain practical strategies for minimizing stress, including gap filler selection, optimized PCB layout, and support implementation
You will leave this webinar empowered to make informed decisions about thermal gap filler selection and application, ensuring your PCB designs remain stress-free and reliable.
See the complete session list for the Virtual Conference on EV Engineering here.
Broadcast live on March 10-13, 2025, the conference content will span the EV engineering supply chain and ecosystem, including motor and power electronics design and manufacturing, cell development, battery systems, testing, powertrains, thermal management, circuit protection, wire and cable, EMI/EMC and more.
